Shenzhen Xuchen Semiconductor Technology Co., Ltd

Shenzhen Xuchen Semiconductor Technology Co., Ltd. is a technology enterprise that focuses on the production, sales, and technical services of semiconductor ultrasonic wire bonding machines. It has been well received by users in more than ten countries and regions in Hong Kong, Macau, Africa, Asia, and other continents

The company mainly produces equipment such as ultrasonic wire ball welding machines, aluminum wire welding machines, and coarse aluminum wire bonding machines, which are widely used in small and medium-sized power, sensors, thick film integrated circuits, transistors, and chip bonding technology

The company has an efficient and professional R&D team dedicated to the R&D and application of semiconductor chip welding technology and Integrated circuit packaging technology. The company has advanced processes and equipment in chip soldering technology, which can achieve high-precision wafer lead soldering, ensuring product quality and reliability. In terms of ultrasonic welding wire technology, the stability performance and service life of the product have been greatly improved

Xuchen adheres to the concept of "quality first, customer first", adheres to the corporate culture of "integrity, innovation, dedication, and cooperation", and continuously improves product quality and service level with a stable and pragmatic business approach, winning the trust and support of a large number of customers

In the future, Xuchen Semiconductor will be market-oriented, increase investment in technology research and development, expand product application fields, and achieve the company's development goals. The company will continue to be committed to providing customers with high-performance and highly reliable ultrasonic bonding products, and providing high-quality semiconductor process solutions to customers worldwide

Products

XE-2018 Ultrasonic Gold Wire Ball Welding Bonding Machine

XE-2018 Ultrasonic Gold Wire Ball Welding Bonding Machine

The gold wire ball welding bonding machine is mainly used in universities, research institutes, research and development centers, and production design. Integrated circuit sensors and precision welding instruments for micro (um) electrode inner leads are easy to operate and use, effectively improving work efficiency and quality.
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XE-219 Ultrasonic Coarse Aluminum Wire Press Welding and Bonding Machine

XE-219 Ultrasonic Coarse Aluminum Wire Press Welding and Bonding Machine

The ultrasonic thick aluminum wire press welding bonding machine can be applied to the internal lead welding of semiconductor power devices such as high and medium power transistors, Field-effect transistor, IGBT, high current fast recovery diodes, schottky diodes, silicon controlled rectifier and power modules. The diameter of aluminum wire: 125~500um
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XE-2010 Ultrasonic Aluminum Wire Pressure Welding and Bonding Machine

XE-2010 Ultrasonic Aluminum Wire Pressure Welding and Bonding Machine

Strong source manufacturer with advanced technology, flexible movement, accurate positioning, and precise guide rail with fast matching speed, especially suitable for precision welding of micrometer (um) electrodes, suitable for laboratory research and development of process chips, internal aluminum wire lead welding of electrodes, providing strong technical support for production and manufacturing
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